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Description du produit
Place of Origin: | Guangdong China (Mainland) | Brand Name: | WDF | Model Number: | FPC000 |
Base Material: | Polyimide(Kapton),Polyester(PET),PEN |
Copper Thickness: | 1/2oz;1OZ;1/3oz | Board Thickness: | 0.08mm~0.12mm |
Min. Hole Size: | 0.07 mm~0.15mm | Min. Line Width: | 0.07 mm~0.15mm | Min. Line Spacing: | 0.07 mm~0.15mm |
Surface Finishing: | Plating AU,PlatingAU,Cover layer |
certificate 1: | UL E300052 | certificate 2: | ISO 9001 |
certificate 3: | ISO 14001 | certificate 4: | TS 16949 | Stiffener material: | Polyimide,Polyester, FR4, Metal |
Shielding material: | Polyimide, FlexibleSolder Mask |
Assembly on FPC: | 0201components, 0.4mmpitch IC& connector |
Packaging Detail: | Inner packing: Vacuum packing / Plastic bag Outer packing: Standard cartonpacking. |
Delivery Detail: | Prototype:2 days for 1L; 4 days for 2L; |
Structure |
Single-sidedBoard |
Double-SidedBoard |
||||
CopperThickness |
Line/SpaceLine/Space(mil) |
Tolerance |
Pitch(um) |
Line/SpaceLine/Space(mil) |
Tolerance |
Pitch(um) |
1oz |
2/2 |
±20%
|
100 |
3/3 |
±20%
|
150 |
1/2oz |
1.4/1.4 |
±20%
|
70 |
2.5/2.5 |
±20%
|
125 |
1/3oz& 1/4oz |
1.2/1.2 |
±15%
|
60 |
2/2 |
±20%
|
100 |
Invitation to | ||
We willpresent following trading showsand sincerely invite you to come to ourbooth, | ||
1.Booth:5G-G08, HKTDCOct,13-16th.2012 Convention and Exhibition Centre,Hongkong | ||
2.HK Globalsources Oct,12-15th,2012 AsiaWorld-Expo,Hongkong | ||
3.Booth:B1-474-2, Electronica2012 Nov, 13-16th in Munich, Germany | ||
4.Booth:71127, CES 2013Jan,8th-11th in Las Vegas,USA |
If you need PCBassembly service, could you give us followinginformation? | ||
1. Gerber file of the bare PCB board | ||
2. BOM (Bill of material) for assembly | ||
To short the lead time, please kindly advise us if there is any acceptable components substitution. | ||
3. Testing Guide & Test Fixtures if necessary |
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